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Supply And Installation Of A Multi-Purpose Chip Bonding System And Advanced Materials Dispenser. Funded By The European Union - Nextgenerationeu Through The Recovery And Resilience Facility. Scientific Project Code: (Micronanofabs_Phase 2)-Icts-Mrr-2024-04-Csic Destined For The Barcelona Institute Of Microelectronics (Imb-Cnm)
| Buyer : Secretaría General de la Agencia Estatal Consejo Superior de Investigaciones Científicas | |
| Create/Change Date : 2026-03-23 21:23:54 | Countries : [Spain] |
| Deadline : 2026-04-08 00:00:00 | Type : Invitation for Bids |
| Original Language : Spanish | |
| Estimated Value : 170000 EUR | View Details |
Indicative Periodic Opinion
| Buyer : SNCF Réseau SA | |
| Create/Change Date : 2025-06-06 10:44:11 | Countries : [France] |
| Deadline : 2026-06-06 00:00:00 | Type : Procurement Plan |
| Original Language : French | |
| Estimated Value : 0 EUR | View Details |